The apparatus of claim 95, wherein the IC chip further comprises at east one power amplifier (PA).ġ00. The apparatus of claim 95, wherein the PCB comprises a mother board.ĩ9. The apparatus of claim 95, wherein the transmission feed lines comprise metal traces.ĩ8.
The apparatus of claim 95, further comprising a clearance volume between the PCB and the antenna array to prevent at least one antenna element from contacting the PCB.ĩ7. An apparatus for a mobile device, the apparatus comprising: a printed circuit board (PCB) that comprises a first layer and a second layer an integrated circuit (IC) chip that comprises a top level and a bottom level, wherein the IC chip comprises a transceiver and the IC chip is connected to the first layer of the PCB an antenna array that comprises a plurality of antenna elements configured within the first layer of the PCB and fed by feed transmission lines coupled to the transceiver and an IC shield that covers the IC to shield the antenna array from interference, and is connected to the PCB, wherein one of the IC shield or a ground layer within the PCB comprises a ground for the antenna array.ĩ6. Amadjikpe, Arnaud Lucres (Beaverton, OR, US)Ĭhakrabarti, Anandaroop (Hillsboro, OR, US)Ĭhoudhury, Debabani (Thousand Oaks, CA, US)ĩ5.
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